Customization: | Available |
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CAS No.: | 61788-97-4 |
Formula: | (C11h12o3)N |
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Epoxy resin is a general term for a three-dimensional cross-linked curing compound that contains two or more epoxy groups in a molecular structure and can be formed under appropriate chemical reagents and appropriate conditions. There are many kinds of them, and according to their chemical structure, they can be divided into glycidyl ethers, glycidyl esters, glycidyl amines, alicyclic epoxies, epoxies containing inorganic elements, and new epoxies (Hyne epoxies, imide epoxies, etc.). Among all kinds of epoxy resins, bisphenol A epoxy resin is one of the most productive and widely used varieties. According to its different molecular weight can be divided into low, medium, high, ultra-high molecular weight epoxy resin (polyphenoloxy resin). The low molecular weight resin can be cured at room temperature or high temperature, but the high molecular weight epoxy resin must be cured at high temperature, and the ultra-high molecular weight polyphenoloxy resin does not need the help of curing agents, and can form a tough film at high temperatures.
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It is used for bonding and fixing of electronic components, crafts and gifts. It has excellent bonding strength for packaging and bonding between metal, ceramics, wood, glass and hard plastics.
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